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AI Accelerates Innovation: Covestro TPU Solutions Drive Smart Device Advancement
Material innovation emerges as a critical enabler as AI transforms smart devices across sectors. From thermal management in edge AI computing to durability requirements in IoT devices and performance demands in robotic components, next-generation smart devices are undergoing significant evolution. Global materials leader Covestro recently showcased its innovative thermoplastic polyurethane (TPU) solutions for the AI era at a technical symposium in Taipei.
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